When the JST power connector is fitted, the highest part is the latch on that connector, which at its highest point is nearly 10mm above the PCB surface.
The configuration GCodes in RRF2 were not flexible enough to handle Duet 3. We also had RRF2 users complaining about the lack of flexibility in allocating pins to external devices. The changes we made in RRF3 address both of these issues.
The limiting factors are likely to be the LEDs (which are typically rated to 85C - although you might not mind if they failed) and the stepper driver IC because it will self-heat (it will start to issue warnings when it reaches about 100C). However, in a heated chamber you will be limited by the temperature rating (typically 85C) of the extruder drive motor anyway, which also self-heats.
Thanks, I’ve corrected it.
When the JST power connector is fitted, the highest part is the latch on that connector, which at its highest point is nearly 10mm above the PCB surface.
Yes you can.
We haven’t tested it in a heated chamber, however all the components are rated to 85C or higher.
Z probe offsets are already reported in the OM at sensors.probes[0].offsets[]
The configuration GCodes in RRF2 were not flexible enough to handle Duet 3. We also had RRF2 users complaining about the lack of flexibility in allocating pins to external devices. The changes we made in RRF3 address both of these issues.
The limiting factors are likely to be the LEDs (which are typically rated to 85C - although you might not mind if they failed) and the stepper driver IC because it will self-heat (it will start to issue warnings when it reaches about 100C). However, in a heated chamber you will be limited by the temperature rating (typically 85C) of the extruder drive motor anyway, which also self-heats.
Yes, if you use RepRapFirmware 3.
You can prefix the G1 command with G53 to make it ignore the tool offset.
G17 is implemented. Do you need G18 and G19 as well?
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